Key takeaways
- Silver gives the lowest resistance and the best current carrying, but it tarnishes and is soft.
- Gold keeps a stable low resistance at low force and low current, but it is expensive and thin gold over a rough surface still has pores.
- Nickel is usually a barrier underplate, not a final contact finish, because its own resistance is higher.
- The underplate, the thickness and the surface finish decide the performance more than the top layer alone.
What a contact finish has to do
A contact finish has four jobs. It keeps the resistance low and stable. It resists wear over the life of the part. It limits corrosion and tarnish in the service environment. And it does all of that at a cost the programme can carry. No single metal wins on all four, which is why the choice depends on the duty.
The base material matters as much as the finish. A silver plate on a rough copper surface copies the roughness, and a thin plate over a pore is a pore with a thin roof. A gold plate over a nickel barrier behaves differently from gold directly on copper, because the nickel stops the copper from diffusing through the gold.
The application sets the priority. A high current switch wants low resistance and resistance to arc erosion. A signal contact wants a stable resistance at low force and a film that does not build up. A connector that is plugged and unplugged many times wants wear resistance. The same three metals are used for all three, in different thicknesses and combinations.
Silver
Silver has the highest electrical conductivity of the common contact metals, and it is the default for current carrying contacts and switchgear. It also has good thermal conductivity, which helps to move heat away from the contact spot. For a joint that carries tens or hundreds of amps, silver is hard to beat on resistance.
The weakness is tarnish. Silver reacts with sulphur compounds in the air and forms a film that raises contact resistance, especially at low force and low voltage. The film is soft and is usually broken by the wipe of a sliding contact, which is why silver works well in switches and less well in a static low force connector. Silver is also soft, so it wears and transfers under repeated operation.
Silver plating thickness for a contact is typically in the range of 2 to 10 µm, with heavier deposits on high current parts. Those figures are typical and illustrative, not a specification. The drawing should state the minimum thickness on the functional surface and the test method, because a thickness measured on a test coupon is not the same as a thickness in a blind hole.
Gold
Gold is chosen for one property above all: it does not form a resistive oxide. That makes it the finish for low voltage, low current signal contacts, where the contact force may be too low to break through a film. A gold to gold contact can hold a stable resistance for a long time in a clean environment.
Gold is soft and expensive, so it is used thin. A thin gold layer over a rough or porous underplate has pores, and the pores expose the layer below. In a humid or sulphurous environment, the base metal can corrode through the pores and the resistance rises. The underplate and the surface finish are therefore part of the gold specification, not an afterthought.
Gold thickness for a contact is often in the range of 0.5 to 3 µm, over a nickel barrier of 1 to 3 µm. These are typical ranges for illustration. A dry circuit contact and a connector that sees many mating cycles need different values, and a thick gold on a poorly finished surface can still fail.
Nickel
Nickel is hard, corrosion resistant and a good diffusion barrier. Those properties make it the usual underplate between a copper alloy and a gold or silver top layer. It stops the copper from migrating into the gold, which would otherwise raise the resistance over time.
Nickel is rarely the final contact finish. Its own contact resistance is higher than silver or gold, and it forms a thin oxide that can be a problem at low force. It is used as a final finish on some terminals and on parts that need wear resistance more than low resistance, but that is a different duty from a switching contact.
The nickel layer also affects the appearance and the adhesion of the top layer. A nickel layer that is too thin may not cover the copper, and one that is too thick can crack under bending. The thickness and the plating bath control the stress, and stress is what decides whether the finish survives a formed bend.
The underplate is not optional
A gold finish on copper without a barrier will change over time as the copper diffuses. Ask for the full layer sequence, not just the top metal.
Thickness, coverage and the drawing
State the minimum thickness on the surfaces that carry current, not an average over the whole part. A contact that is plated all over may be thin at the contact face and thick on a corner, depending on the rack and the current density. Selective plating or masking is often the better route for a high cost finish.
Say how the thickness is measured. X-ray fluorescence is common and fast, but it measures a small spot and can be affected by the underplate. A cross section gives a direct reading but destroys the part. A coulometric method works for some coatings. The method belongs on the drawing because two methods can disagree on the same part.
Add the adhesion requirement. A bend test, a tape test or a thermal shock test can show whether the layer is bonded. A finish that passes a thickness check and fails adhesion will flake in service. For a formed contact, test the finish after forming, because the bend is where the coating is most highly stressed.
Wear, porosity and fretting
Wear removes the finish at the contact spot. A soft finish wears faster, and a thin finish reaches the underplate sooner. The result is a change in resistance and, in a humid environment, a corrosion cell at the exposed area. The wipe of the contact helps, because it moves the contact spot to a fresh area, but it also wears the finish.
Porosity is the other route to failure. A plated layer is not perfectly dense, and the pores connect the surface to the base metal. Corrosion products can grow through the pores and lift the finish. A thicker layer reduces porosity, and a good underplate limits the damage when a pore exists.
Fretting is the small amplitude movement that occurs in a connector under vibration or thermal cycling. It wears the finish and produces oxide debris at the contact spot. Gold is resistant to oxide growth but still wears, and a nickel underplate can crack under fretting. A contact design that limits movement at the contact spot is as important as the finish.
Choosing the finish
The table below compares the three finishes on the points that decide a contact programme. Use it to narrow the choice, then confirm the thickness and the test with the supplier and a life test.
| Finish | Typical thickness | Contact resistance | Best for | Main risk |
|---|---|---|---|---|
| Silver | 2 to 10 µm | Lowest | Current carrying and switching contacts | Tarnish and wear |
| Gold | 0.5 to 3 µm over nickel | Low and stable | Signal and low force contacts | Cost and porosity |
| Nickel | 1 to 5 µm | Higher | Barrier layer and wear surfaces | Oxide film and stress |
The thickness ranges are typical and illustrative. Set the minimum on the functional surface and state the measurement method.
Frequently asked questions
Is gold always better than silver for contacts?
No. Gold is better for low voltage, low current signal contacts because it does not form a resistive oxide. Silver is better for current carrying and switching contacts because it has lower resistance and costs less.
Why is nickel used under gold?
Nickel acts as a diffusion barrier. It stops copper from the base metal migrating into the gold, which would raise the resistance over time. It also improves wear resistance.
How thick should contact plating be?
It depends on the duty and the finish. Silver is often 2 to 10 µm, gold 0.5 to 3 µm over a nickel barrier. These are typical ranges, so the drawing should state the minimum on the functional surface.
Can plated contacts be formed after plating?
Yes, but the bend puts the coating under strain. Test the adhesion after forming, and check that the finish thickness at the bend still meets the minimum.
Sources and further reading
- ASTM B539, Standard test methods for measuring resistance of electrical connections
- ISO 4524 series, Metallic coatings, electroplated gold coatings
- Qumek contact finish specification and inspection notes
Qumek Engineering Desk
Engineering team
The engineering team behind Qumek drawings, DFM notes, tolerances and inspection standards. Every guide is reviewed against the drawings and processes used on live programmes.
Choosing a finish for a contact or terminal?
Send the duty and the environment. The engineering desk will reply with a note on the layer sequence and the thickness to specify.
Send a contact drawing