Heat sink mounting and flatness: making contact
A flat sink, a clean pad and the right screw torque still fail if the pressure is in the wrong place. Contact is a system property.
Topic hub
Machined, cast and extruded parts are chosen for geometry, strength and thermal performance. These guides cover process selection, tolerances, finishes, casting defects and the thermal path from a die to the air.
A flat sink, a clean pad and the right screw torque still fail if the pressure is in the wrong place. Contact is a system property.
Where air cooling stops being practical, how cold plates change the heat sink design, and the flatness and pressure calls that decide whether a liquid loop works.
Thread standards, sealing methods and the wall thickness that decides whether a brass fitting holds pressure or strips at assembly.
The word passivation means different things on copper and brass. Here is how to specify a finish that protects the surface without turning a conductive part into an insulator.
How a die casting is filled, solidified and ejected, and the wall, draft, fillet and boss rules that come directly from those steps.
Three ways to put fins on a base, three different limits. The choice is usually set by fin aspect ratio, volume and the joint you are willing to inspect.
Manual, vibratory and thermal deburring solve different problems. A practical guide to choosing the method, writing the edge call and keeping the cost out of the wrong place.
How luminaire shape, fin orientation and visible surfaces decide the heat sink, and where die casting earns its place over extrusion.
Why an Ra number on its own does not describe a copper contact face, and how lay, waviness and oxide decide the joint.
A single design review that works across machining, casting and extrusion, with the questions that change by process and the ones that never change.
Copper conducts almost twice as well, and weighs more than three times as much. The right choice depends on where the bottleneck sits in the thermal path.
What anodising does to a heat sink, when black beats clear, and why the oxide layer must be kept away from the thermal interface.
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